TriQuint Semiconductor introduced Qualcomm 3G chipsets support the latest WEDGE solution

TriQuint Semiconductor introduced Qualcomm 3G chipsets support the latest WEDGE solution
  TriQuint Semiconductor has announced a new RF front-end solutions in support of Qualcomm (Qualcomm) * latest release of 3G chipset. TriQuint solutions include the introduction of the TRITON PA Module for WCDMA series and for the GSM / EDGE, HADRON II PA Module amplifier module TQM7M5013. The solution has excellent performance, low power consumption and the characteristics of the industry's smallest size is suitable to meet, including data cards, the Internet present, e-readers and the rapid development of next-generation smart phones, including mobile device market.
  This product combines the complete WEDGE TriQuint's highly optimized WCDMA and GSM / EDGE products. TriQuint Semiconductor, General Manager of China Xiong Ting said: "We are building a market leader in EDGE PAM position and the accumulation of our smart phones, data cards and other mobile Internet devices (MID) the fastest-growing markets such as product experience. Each wireless device more and more discrete band WCDMA amplifiers drive the market, also represents an important opportunity to expand market share. TriQuint has been committed to optimizing our technology for industry-leading 3G chipset supplier to provide a highly competitive, complete RF front-end solutions. advance the main users are satisfied with the performance and integration of this product roadmap. we expect that the products in the second half of 2010 will have a strong market adoption. "
Latest 3x3mm TRITON discrete amplifier modules cover all the major 3GPP WCDMA frequency bands, and has multi-mode operation capability. TRITON products provide extremely low power consumption and excellent thermal performance, which the current feature-rich smart phones and wireless devices is essential. TriQuint company using its proprietary manufacturing process - copper convex flip chip (CuFlip)
And TQBiHEMT-to design the performance, size, efficiency of the TRITON series are excellent products. CuFlip process has outstanding RF performance and design flexibility, and speed up manufacturing and assembly; TQBiHEMT process so that the two gallium arsenide (GaAs) process into a single chip, reducing component count and saves board space. These processes can TriQuint module companies use a single chip to provide an integrated feature, but now the market all the other solutions require multiple chips and / or complex assembly process, TriQuint solution that has unparalleled advantages.
TQM7M5013 is a 5x5mm quad-band HADRON II PA module, used with the TRITONve.com/">Wafer Lug Butterfly Valve.